The ProSeries RGBHV product group provides 12 different distribution amplifiers for component video and horizontal/vertical sync.
Single Unit Pricing $698.00
Dual Sync Mode:
- The dual sync mode units permit the user to select between TTL level H/V and video level H/V. A DIP switch is used to select between the two modes.
- The DIP switch controls RF relays that change the input termination and gain parameters for the two H/V signal configurations. When switch 1 is OFF the unit is in TTL level mode and when switch 1 is ON the unit is in video level mode. Switch 2 does not affect the operation of the unit. If the user knows the type of H/V signals that the system uses, selecting the correct product configuration and not using the dual sync mode units provide a more reliable product because the DIP switch and relays are eliminated.
|Input 1 Signal Type||Component Video|
|Input 1 Coupling||DC|
|Input Configuration 1||Standard 75 Ohms|
|Input 1 Connector||BNC|
|Output 1 Signal Format||Component Video|
|Output 1 Coupling||DC|
|Output Configuration1||Standard 75 Ohms|
|Output 1 Connectors||BNC|
|Power Connector||2 Pin 2.5mm TB|
|Input Voltage 1||10-28 VAC|
|Input Voltage 2||10-32 VDC|
|Low Operating Temp (C)||-40|
|High Operating Temp (C)||80|
|Control 1 Connector||Dip Switch|
|Mounting||Two 6-32 Inserts|
This unit has a non-isolated internal switcher power supply (FlexPWR). The unit will operate correctly on 10-28 VAC or 10-32 VDC. The power input is protected so power can be applied in either polarity.
The supply provides the internal electronics with power with the ground of the video circuits being the same as the input power ground.
The power connector is a 2-pin 2.5mm terminal block with detent retention that can support high vibration environments.
The package for this unit consists of a solid epoxy block. The internal electronics are assembled and tested before the encapsulation process. During the encapsulation the printed circuit board(s) are placed in a five sided box made of RTV mold parts.
The cavity is filled with epoxy and the lid (top) of the mold is inserted. The curing process takes 24 hours. This type of package seals the electronics so water and contamination cannot affect the internal electronics.
This type of package also provides superior resistance to shock and vibration compared to a metal or plastic box enclosure.