The 13-111-104 is a one input to four output SDI video distribution amplifier with a single ended input (75 Ohm termination). This unit does equalization on the input signal to correct for long cables and re-clocks the output to remove jitter. Unused outputs do not need to be terminated with 75 Ohms. All of the video connections are BNC connectors. This unit is intended to be used with SDI (SMPTE 424M, SMPTE 292M, SMPTE 259M) video signals.
Single Unit Pricing $855.00
- SDI video distribution amplifier (DA)
- 1 input, 4 output configuration
- Data Rates: 125 Mbps to 2.97 Gbps
- Outputs are re-clocked
- Standard single ended 75 Ohm terminated input
- BNC connectors for video signals
- Sealed epoxy package
- Isolated power supply (12-24 AC, 10-34 DC)
- 2.2” X 4.4” X 0.65” size (not including connectors)
- Mounted using two 6-32 threaded inserts
|Input 1 Signal Type||SDI Video|
|Input 1 Coupling||AC|
|Input Configuration 1||Standard 75 Ohms|
|Input 1 Connector||BNC|
|Output 1 Signal Format||SDI Video|
|Output 1 Coupling||AC|
|Output 1 Connectors||BNC|
|Power Connector||4 pin 3.5mm TB|
|Input Voltage 1||12-24 VAC|
|Input Voltage 2||10-34 VDC|
|Low Operating Temp (C)||-40|
|High Operating Temp (C)||85|
|Mounting||Two 6-32 Inserts|
The common application of this unit is to generate four copies of a single SDI video signal so several downstream devices can be driven without degradation of the video quality. Because this is an active device (requires power) signal quality as well as signal level are maintained while generating the multiple copies of the original signal.
This unit has an isolated internal switcher power supply. The unit will operate correctly on 12-24 VAC or 10-34 VDC. The power input is protected so power can be applied in either polarity. The supply provides the internal electronics with power totally ground isolated form the power input. No opto electronics are used so the unit is not temperature limited by the isolated supply. The power connector is a four pin plug with jack screws so the power connection can support high vibration environments. In addition to the two pins used for power input, a third pin provides access to the internal electronics ground circuit. The fourth pin provides access to an internal chassis ground that connects to internal ESD protection devices.
The package for this unit consists of a solid epoxy block. The internal electronics are assembled and tested before the encapsulation process. During the encapsulation the printed circuit board(s) are placed in a five sided box made of RTV mold parts. The cavity is filled with epoxy and the lid (top) of the mold is inserted. The curing process takes 24 hours. This type of package seals the electronics so water and contamination cannot affect the internal electronics. This type of package also provides superior resistance to shock and vibration compared to a metal or plastic box enclosure.