[85-111-704] 1x4, High Performance VGA/XGA Distribution Amplifier


The 85 Series Distribution Amplifiers “DA’s” include in this manual provide a way to distribute one XGA/VGA signal to up to Two or Four other devices. Extended Display Identification Data (EDID) link exists between Input and OUT-1.

85-111-702 (1X2)

85-111-704 (1X4)

Single Unit Pricing $538.00


  • The internal power supply is fully isolated to permit the user to control ground loops. The power connection has an integrated threaded/screw flange for shock and high vibration environments.
  • All input and output connections are High Density “HD” 15 pin connectors, typical of VGA/XGA.
  • Output signals are buffered, and are identical with respect to the input.
  • Output 1 is provisioned as a local master for Extended Display Identification Data (EDID).
  • Input HD-15 pin-9 is passed to pin-9 of the local master output.
  • This is a +5V signal, sourced by the graphics card connected to the input, typically providing power for EDID functionality.


# Channels1
Input 1 Signal TypeVGA Video
Input 1 CouplingDC
Input Configuration 1Standard 75 Ohms
Gain ConfigurationUnity
Input 1 ConnectorVGA
Output 1 Signal FormatVGA Video
Output 1 CouplingDC
Output 1 ConnectorsVGA
Power Connector4 pin 3.5mm TB
Input Voltage 112-24 VAC
Input Voltage 210-34 VDC
Weight Oz7
High Operating Temp (C)85
Power BypassNO
MountingTwo 6-32 Inserts



Power Supply

This unit has an isolated internal switcher power supply. The unit will operate correctly on 12-24 VAC or 10-34 VDC. The power input is protected so power can be applied in either polarity. The supply provides the internal electronics with power totally ground isolated form the power input. No opto electronics are used so the unit is not temperature limited by the isolated supply. The power connector is a four pin plug with jack screws so the power connection can support high vibration environments. In addition to the two pins used for power input, a third pin provides access to the internal electronics ground circuit. The fourth pin provides access to an internal chassis ground that connects to internal ESD protection devices.


The package for this unit consists of a solid epoxy block. The internal electronics are assembled and tested before the encapsulation process. During the encapsulation the printed circuit board(s) are placed in a five sided box made of RTV mold parts. The cavity is filled with epoxy and the lid (top) of the mold is inserted. The curing process takes 24 hours. This type of package seals the electronics so water and contamination cannot affect the internal electronics. This type of package also provides superior resistance to shock and vibration compared to a metal or plastic box enclosure.