[83-141-001] 1x1, VGA to Comp YC Converter, Std Input

Description

The 83-141-001-A is a video format converter specifically designed to convert analog VGA video into analog Composite/YC video. The initial unit has been specifically designed to convert 1024X768 VGA into NTSC composite/YC format.

Single Unit Pricing $1152.00

Highlights

  • This conversion requires down scaling the VGA video to NTSC.
  • The converter uses an FPGA to perform the scaling.
  • An analog to digital decoder is used on the front end and a digital to analog encoder on the back end.
  • To control ground loops the 83-141-001-A uses an isolated power supply.
  • The unit requires 45-50 seconds to load the FPGA at power-up and become fully functional.
  • A USB port provides a means to upload new operational code and FPGA configuration files.

Features

GroupIsolated
# Channels1
Inputs/Channel1
Outputs/Channel1
Input 1 Signal TypeVGA Video
Input 1 CouplingAC
Input 1 Signal Format1024 x 786
Input Configuration 1Standard 75 Ohms
Input 1 ConnectorVGA
Output 1 Signal FormatComposite Video
Output 1 CouplingAC
Output 1 ConnectorsBNC
Power Connector4 pin 3.5mm TB
Input Voltage 112-24 VAC
Input Voltage 210-34 VDC
Height1.4
Width4.4
Depth2.2
Weight Oz14
High Operating Temp (C)70
Power BypassNO
MountingTwo 6-32 Inserts

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Power Supply

This unit has an isolated internal switcher power supply. The unit will operate correctly on 12-24 VAC or 10-34 VDC. The power input is protected so power can be applied in either polarity. The supply provides the internal electronics with power totally ground isolated form the power input. No opto electronics are used so the unit is not temperature limited by the isolated supply. The power connector is a four pin plug with jack screws so the power connection can support high vibration environments. In addition to the two pins used for power input, a third pin provides access to the internal electronics ground circuit. The fourth pin provides access to an internal chassis ground that connects to internal ESD protection devices.

Package

The package for this unit consists of a solid epoxy block. The internal electronics are assembled and tested before the encapsulation process. During the encapsulation the printed circuit board(s) are placed in a five sided box made of RTV mold parts. The cavity is filled with epoxy and the lid (top) of the mold is inserted. The curing process takes 24 hours. This type of package seals the electronics so water and contamination cannot affect the internal electronics. This type of package also provides superior resistance to shock and vibration compared to a metal or plastic box enclosure.